Metal base substrate
A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.
A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.
- Company：モリマーエスエスピー 本社
- Price：Other
